Radiation-Hardened Electronics Market Worth $2.04Bn, Globally, by 2028 at 4.3% CAGR

The Insight Partners

The radiation-hardened electronics market size was valued at $1.52 billion in 2021 and is projected to reach $2.04 billion by 2028; it is expected to grow at a CAGR of 4.3% from 2021 to 2028.

New York, April 29, 2022 (GLOBE NEWSWIRE) — The Insight Partners published latest research study on “Radiation-Hardened Electronics Market Forecast to 2028 – COVID-19 Impact and Global Analysis – by Component (Power Management Components, Analog & Digital Mixed Signal Devices, Memory, and Controllers & Processors), Manufacturing Technique [Radiation Hardening by Design (RHBD) and Radiation Hardening by Process (RHBP)], and Application (Aerospace & Defense, Nuclear Power Plant, Space, and Others)”, the global radiation-hardened electronics market growth is driven by the increasing investment in product development by major players.

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Report Coverage


Market Size Value in

US$ 1.52 Billion in 2021

Market Size Value by

US$ 2.04 Billion by 2028

Growth rate

CAGR of 4.3% from 2021 to 2028.

Forecast Period

2021- 2028

Base Year


No. of Pages


No. Tables


No. of Charts & Figures


Historical data available


Segments covered

Component, Manufacturing Technique, and Application

Regional scope

North America; Europe; Asia Pacific; Latin America; MEA

Country scope

US, UK, Canada, Germany, France, Italy, Australia, Russia, China, Japan, South Korea, Saudi Arabia, Brazil, Argentina

Report coverage

Revenue forecast, company ranking, competitive landscape, growth factors, and trends

Radiation-Hardened Electronics Market: Competitive Landscape and Key Developments
The leading players operating in the radiation-hardened electronics market across the globe include BAE Systems; Data Device Corporation; Honeywell International Inc.; Infineon Technologies AG; Renesas Electronics Corporation; Texas Instruments Incorporated; STMicroelectronics; Xilinx, Inc.; VORAGO Technologies; and Microchip Technology Inc. Several companies are functioning in the market and are contributing substantial revenues to propel the radiation-hardened electronics market growth.

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In 2022, BAE Systems has been awarded a $60 million contract from the Army Contracting Command. The program’s principal purpose is to provide the US government and aerospace sector with onshore access to cutting-edge microelectronics technology. Cadence Design Systems, Carnegie Mellon University, Novellus, Reliable MicroSystems, and Sandia National Laboratories will be part of a team that will carry out this work.

In 2021, Xilinx, Inc. announced its collaboration with Mavenir. The collaboration consists of companies working together to deliver a unified 4G/5G O-RAN massive MIMO portfolio to market to allow Open RAN deployments. In Q4 of 2021, the first mMIMO 64TRX joint solution was planned to be ready. The two businesses collaborated to effectively integrate a first-generation mMIMO system leveraging Open RAN concepts from end to end.

Space programs across developed and developing countries have experienced a rise in investment. This growth is attributed to the rising

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