Apple View Ultra dive computer system not offered right up until afterwards this calendar year

One particular of the most extraordinary attributes demonstrated in the Apple keynote was the Apple Check out Ultra dive laptop operation. This successfully enables the new rugged observe to completely switch a committed dive personal computer.

Having said that, everyone who’s just taken supply of their Apple Enjoy Ultra, and is seeking to don their scuba equipment and head down to the closest coral, will have to have to wait a although …

Apple’s world-wide-web site for the Ultra initially would make it audio like it is completely ready to roll for diving:

Designed to withstand jetskiing in Maunalua Bay or kitesurfing the Gorge. Apple Watch Extremely options a new depth gauge. It also provides the info and operation expected by scuba and free of charge divers for descents down to 40 meters.

EN13319 accredited. An internationally acknowledged standard for diving extras.

But a minimal further more down, there is a “Coming soon” badge.

Coming before long. A comprehensive-featured dive computer system. Intended in partnership with renowned underwater innovators Huish Outdoors, the Oceanic+ application for Apple Observe Extremely places a bona fide dive pc on your wrist.8 Designed for recreational scuba diving and free diving down to 40 meters, with all the main features divers need. It’s also refreshingly simple to use.

The crafted-in Depth app is preinstalled, but Apple especially warns that this have to not be made use of as a dive personal computer.

During recreational underwater routines these types of as snorkeling, underwater pool swims, and shallow free-diving, the Depth application can display you important info. The Depth application demonstrates the existing time, your current depth, the session’s most depth when you’ve been underwater, and the water temperature.

Underwater things to do are dangerous. The Depth app isn’t a dive computer system and doesn’t supply decompression quit details, gas analysis, or other leisure scuba diving features. If you are employing Apple Enjoy Extremely wherever the failure of the gadget could lead to dying, personalized injury, or critical environmental destruction, normally use a secondary depth gauge and timer/enjoy. Before heading on a dive, be positive your Apple Enjoy Extremely is absolutely free of cracks or other harm.

Once the Oceanic+ application is accessible, you will then have a licensed Apple View Ultra dive computer.

A dive planner with local information. The Oceanic+ app on Iphone goes beyond calculating just depth and time by integrating local circumstances like tides, h2o temperatures, and even community‑fed facts like visibility and currents. Or simply just use your check out to speedily and effortlessly plan your dive.

Metrics that make additional feeling. Most dive desktops have to have a elaborate sequence of button pushing to get what you need to have. Oceanic+ allows you accessibility further screens basically by turning the Digital Crown. It utilizes color‑coding on the large, vibrant show to make complicated information easy to understand.

Security in no way stops. All the safety warnings you assume from a dive computer are incorporated into Oceanic+, from decompression limits to abnormal ascent

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Apple’s M1 Ultra Shows the Future of Computer Chips

Apple’s M1 Mac processor family began with the M1 in 2020 and expanded — literally — with the M1 Pro, M1 Max and M1 Ultra. The M1 Ultra is made of two M1 Max chips.


If you want a glimpse of where the processor business is headed, check out Apple’s new M1 Ultra processor.

To deliver speed and performance, the consumer electronics giant married two of its older M1 Max chips using advancements in a once humble aspect of chipmaking called packaging. Packaging no longer just provides a protective housing but now also offers cutting-edge communication links.

By combining the two chips, Apple’s M1 Ultra delivers a stunning 114 billion transistors that make up 20 processing cores and 64 graphics cores. By comparison, AMD Ryzen desktop processors use something like a tenth that number of transistors.

The M1 Ultra highlights the progress chipmakers have achieved in keeping Moore’s Law alive. A dictum in the chip industry, Moore’s Law predicts that the number of transistors on chips doubles every two years. Transistors, the basic circuit elements that process data, have been harder to miniaturize, which has slowed the progress initially charted by chip pioneer and Intel co-founder Gordon Moore. Advanced packaging offers a new way to bump up those transistor counts.

Apple isn’t the only company working on advanced packaging technology to link chips together.  Intel, AMD and Nvidia also have technology to combine multiple chip elements, called dies or chiplets, into a single larger processor. The M1 Ultra is arguably the most advanced example of the concept so far, but it won’t be the last.

“You’ll see it in mainstream PCs over time,” said Tech Insights analyst Linley Gwennap, not just the Mac Studio systems costing $4,000 and up.

Chip packaging advances

Packaging has been around for as long as chips have been. Initially, it involved a housing to protect a processor and provide it with the electrical links to memory, communications and other elements of a computer. Over the years, it’s gotten more and more complex. Now chipmakers see advanced packaging as a crucial element in sustaining computing progress.

Meteor Lake test chips

Fine lines in these Intel Meteor Lake test chips show how multiple chiplets make up the whole processor.

Stephen Shankland/CNET

Apple’s UltraFusion, the name of its packaging technology, uses a narrow silicon slice called an interposer that resides beneath the two M1 Max chips, linking them with 10,000 wires that can carry 2.5 terabytes of data per second over a very short distance. That enormous speed is necessary so chip cores on one die can reach memory that’s connected to the other. Graphics processing units in particular have an insatiable appetite for data stored in memory.

Interposers historically have been large and expensive. Apple’s custom approach involves a narrower slice that only traverses the connecting edges of the M1 Max chips.

Intel has developed a similar packaging technology, which it calls Embedded Multi-Die Interconnect Bridge. Intel hasn’t used EMIB in any chips that are on the market

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